CSL850 Heat Sink Compound is a non-curing, water resistant paste which is heavily filled with conductive metal oxides.
CSL850 will not dry out, harden or melt in exposure to temperatures up to 200°C (392°F).
CSL850 features good thermal conductivity, low bleed, and allows for easy rework.
CSL850 maintains a positive heat sink seal that facilitates heat transfer from the device to the heat sink, thereby increasing overall efficiency of the device.
CSL850 is primarily used for heat management in electrical and electronic component manufacturing.
- Non-curing compound
- Good thermal conductivity
- Retains consistency in temperatures up to 200°C
- Low bleed
- Easy rework
- Thermally conductive
- Electrically insulating
- Resists moisture and temperature extremes
CSL850 is generally used to thermally couple electrical and electronic devices to heat sinks and it is often used along with mechanical fasteners to prevent movement.
CSL Silicones line of thermal management products includes CSL 519 Heat Conductive Sealant.