CSL-506 Self-Leveling Electronic Silicone Sealant/Adhesive

Recognized under the Components Program of UL®

Neutral cure formulation

Will not corrode copper, brass or silver

Effectively fills small spaces

Applications include potting electrical terminals and sealing electronic devices to prevent the ingress of moisture and other contaminants 506FC
506T
CSL-519 Heat Conductive Sealant

Neutral cure formulation

Non-corrosive

High thermal conductivity

High dielectric strength

Provides maximum protection for electronics

Typical applications include: thermocouple wells, solar panels, heat exchangers, thermo-electric coolers, thermal coupling and sealing in appliances
CSL-541 Conformal Silicone Coating

Neutral cure formulation

Non-corrosive to metals in electronic/electrical equipment

Coating can be applied by spray, flow and brush techniques

Highly effective as a coating for circuit boards to protect from contamination
CSL-542 Low Viscosity Conformal Silicone Coating

Neutral cure formulation

Non-corrosive to metals in electronic/electrical equipment

Coating can be applied by spray, flow and brush techniques

Low viscosity

Highly effective as a coating for circuit boards to protect from contamination
CSL-588 Electronic Grade Silicone Sealant/Adhesive

Neutral cure formulation

Recognized under the Components Program of UL®

Meets MIL-A-46146A, Type 1 specifications

Non-corrosive to metals in electronic/electrical applications

Designed as a durable general-purpose sealant/adhesive for a wide range of electrical and electronic applications including: lead wire entries, conduit terminal boxes and connectors, component mounting, conduit ends, splices, cover plates, printed circuit boards, etc.
CSL-850 Heat Sink Compound (white)

Non-curing compound

High thermal conductivity

Low bleed

Retains consistency over a temperature range of -50°C to 200°C (-55°F to 390°F)

Generally used as a thermal coupling of electrical/electronic devices to heat sinks.  It can be used as an effective thermal coupler for any heat sink device where efficient cooling is required.

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